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Principal Application Engineer – semiconductor packaging

  • Irvine, CA
  • $130,000 to $155,000
OPEN JOB: Principal Application Engineer – semiconductor packaging
LOCATION: Irvine, California
***Relocation Assistance Available
INDUSTRY: Manufacturing & Production
BASE SALARY: $130,000 to $155,000

This position is with our client’s Adhesive Technologies business unit (adhesives, sealants and functional coatings)
   
What you´ll do 
  • Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
  • Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
  • Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
  • Responsible for application functions and tasks to sales, marketing, PD and other business units 
  • Manage a small (2-4) Application Engineering team to achieve project deliverables

Requirements:
  • Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
  • 12 years of experience in semiconductor packaging or processes with people manager experience
  • Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
  • Proven ability to work independently and lead technical discussions with customers
  • Strong communication skills with a customer-focused, ownership-driven mindset
  • Effective project and time management skills, with a consistent focus on quality and delivery
  • Willingness to travel up to 10%
  • Ability to take meetings with our APAC team during off-hours

If you are interested in pursuing this opportunity, please respond back and include the following:
 
  • MS WORD Resume
  • required compensation.
  • Contact information.
  • Availability
 
Upon receipt, one of our managers will contact you to discuss the position in full detail.


STEPHEN FLEISCHNER
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL: sfleischner@intermediagroup.com
LINKEDIN: https://www.linkedin.com/in/stevefleischner/